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Senior/Staff Process Engineer (Wafer Bumping/Fan-Out)

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placeSingapore home_workPresencial scheduleTempo integral labelEngineering Jobs publicVaga agregada · SG

eventPublicada em 24 de jul. de 2026 · verifiedVerificamos em 11 de ago. de 2026 que ainda está no ar

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Core Responsibilities Lead the process development and technical support of the wafer bumping, and/or Fan-Out process for silicon photonic chip wafers, with OSAT or at internal line. Process Pathfinding & Integration: Design and optimize early-stage process flows for wafer bumping, thin-film sputtering, lithography, electroplating, and ball drop execution. DOE to characterize process window and margin. Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, …

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